Machining & Grinding


Precision Ceramic Grinding, Precisely How You Want It


Since PremaTech Advanced Ceramics was established more than 35 years ago, we have become a leader in adaptive ceramic grinding techniques. That level of expertise allows us to provide customers with precision, quality and value in every component we fabricate from technical ceramics or hard materials.

Our ceramic grinding equipment includes:

  • Universal, Surface & Creep-Feed Grinders
  • ID, OD, Jig & Centerless Grinders
  • 5 Axis CNC
  • Flat/Roll Lapping Machines
  • Gang Wheel Slicers
  • Hole Drilling (to 0.020″)
  • Lapping and Polishing Equipment

Some advanced ceramics are relatively easy to grind, but most are very labor intensive and present significant challenges in obtaining quality results. For these reasons, our engineers can work closely with you to ensure the product meets your requirements.

Attention to detail and quality control are paramount when executing production of any volume, as each finished piece must be manufactured with exacting specifications. Our skilled machinists uphold stringent controls to deliver the precision and quality required for your job.

Semiconductor Cleaning

Excellence in Part Conditioning & Cleaning

Our ISO Class 5 Cleanroom has the most modern cleaning and packaging equipment. This highly controlled environment enables us to monitor water quality and other elements of our processes. The cleanroom features:

  • Ultra-Pure Water System
  • Redundant Chemical Wet-Process Benches
  • High Capacity Cleaning Stations to Accommodate Large Critical Parts

To remove surface damage to our CVD SiC and ceramics, our conditioning process includes:

  • Pre-Cleaning to remove contaminants
  • Thermal Oxidation of the SiC surface
  • Acid Strip of Oxide Layer
  • Ultrasonic De-Ionized Water (DIW) Cleaning

Learn more about our semiconductor cleaning capabilities.


CVD SiC Machining

Superior Properties for the Most Demanding Applications

PremaTech is a leader in Chemical Vapor Deposition Silicon Carbide (CVD SiC) solutions. This material’s outstanding performance is ideal for environments that need to resist chemical erosion, extreme temperatures and thermal shock.

To ensure that your CVD SiC is of the highest quality, we source material manufactured using the most modern technology to prevent contamination and maximize yield. The result is a solid material that is 99.9995% pure, theoretically dense and contains no voids or micro-cracks.

Additionally, the material’s crystal structure produces a homogenous material that is consistent within single production runs, as well as from one batch to another.

Key features of PremaTech CVD SiC fine-grained, theoretically dense microstructures include:

  • Outstanding Resistance to Wear, Corrosion & Thermal Shock
  • Low Coefficient of Thermal Expansion (CTE)
  • Dimensional Stability
  • Exceptional Flatness
  • Excellent Stiffness-to-Weight Ratio (lightweight similar to Al & Be)
  • Diamond-Like Hardness
  • Mirror-Like Surface Finishes

The CVD SiC we supply for 100, 150, 200 and 300mm semiconductor applications offers:

  • Outstanding Performance in Chemical & Plasma Environments & at High Temperatures (up to 1700°C)
  • Low Cost of Ownership
  • Improved Productivity (Higher Yields from Faster Throughputs & Cycle Times)
  • Excellent Resistance to Wear, Abrasion, Corrosion, Oxidation & Erosion


High & Low Resistivity Grades

To maximize performance of our CVD SiC for your specific application, we fabricate three grades of components in a wide range of shapes and sizes. The grades we offer are:

  • Low Resistivity (<1 Ω cm)
  • High Resistivity (>500 Ω cm)

For details on the properties of our CVD SiC, see this data sheet.

Semiconductor Components

Our ultra-high purity, high temperature CVD SiC is ideal for:

  • RTP & EPI Rings
  • Susceptors
    • Cover Plates
    • Wafer Carriers
  • Plasma Etch Chamber Components
    • Gas Diffusion Plates (GDPs)
    • Focus Rings

Our controlled lower and high resistivity grades are ideal for wafer handling and chamber components in plasma etch and MOCVD equipment.

The CVD SiC we supply for 100, 150, 200 and 300mm semiconductor processing applications offer:

  • Controlled Resistivity
  • Higher Purity
  • Longer Life
  • Lower Particle Generation
  • Better Temperature Uniformity

When it comes to plasma etch chamber equipment, CVD SiC chemistry results in longer component life. Likewise, for thermal process applications, CVD SiC’s low mass, and very thin and thermally stable cross sections, yield excellent temperature uniformity across the wafer during processing. Let us put our expertise to work for you.


Lapping & Polishing

Achieving Smoother Surfaces on Ceramic and Other Hard Materials

Lapping is the process of using a loose abrasive between two surfaces that rub together, thus abrading the part. Typically, lapping is used to achieve a surface roughness and flatness beyond the capabilities of standard grinding.

Deciding the combination of abrasive and lap material to use is a choice that’s based on the type of material being lapped. That decision is critical because the choices will affect material removal rates, surface roughness, and the lap’s ability to hold its form.

A softer lap allows more of the abrasive to embed in it and produces a better finish with less material removal. A harder lap enables the abrasive to roll “freely” and produce more removal. The tradeoff, however, is that the finish will not be as good as one performed with a softer lap. Along with the changing of laps, abrasive size decreases accordingly to yield better finishes.

Polishing is similar to lapping in concept, but the process of removing microscopic surface roughness (asperities) is complicated. Polishing can involve the removal of molecule clusters at an atomic level. Because polishing occurs at such a small scale, it is often difficult to explain effective ways to remove asperities.

There are differing opinions on how, and why, polishing works, with a majority of what we know coming from empirical data.

Depending upon the component material and kind of abrasive used, mechanical and chemical removal mechanisms can work together or independently to achieve the desired result. Another polishing consideration is the kind of material used as the lap. A lap can range in hardness from cast iron or tin to wax or pitch.               


Tell us about your application.


Test Specimens 

We provide a wide range of test specimens. Tell us about your specific requirements, and we’ll tell you how we can meet them.

Other Capabilities 

If you need a service not mentioned in descriptions of our capabilities, let us know what it is, and we’ll do everything possible to accommodate you. 


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